The HiSilicon Kirin 710 is an 8-core mid-range mobile System on Chip (SoC) announced by Huawei in July 2018, manufactured on a 12-nanometer process by TSMC. It features a big.LITTLE CPU architecture with four Cortex-A73 cores clocked at 2.2 GHz and four Cortex-A53 cores at 1.7 GHz, paired with an ARM Mali-G51 MP4 GPU.
| Spec | Description |
|---|---|
| Manufacturer | HiSilicon (Huawei) |
| Process | 12 nm FinFET |
| CPU | Octa-core (4x Cortex-A73 @ up to 2.2 GHz + 4x Cortex-A53 @ up to 1.7–1.8 GHz) |
| CPU architecture | ARMv8‑A (64‑bit). |
| GPU | Mali-G51 MP4 |
| NPU | No dedicated NPU (some devices use software/ISP-based AI features) |
| Memory support | LPDDR3 / LPDDR4 (depending on device implementation) |
| ISP / Camera | Dual ISP supporting up to ~24 MP single camera (device-dependent), Common features: noise reduction, HDR, face detection (implementation varies) |
| Video | Hardware decoding/encoding support (typical formats: H.264/H.265), exact max resolutions depend on device integration |
| Connectivity | Integrated modem for LTE (Cat.12/13 in many implementations), Wi‑Fi/Bluetooth depend on device OEM |
| Target market | Upper‑midrange (launched 2018) |
| Typical uses | Midrange smartphones (e.g., Huawei P Smart 2019, Honor 8X, Nova 3e variants) |
Many Kirin 710 devices have community root/ROM work but difficulty varies: Huawei locked bootloaders and enforced signed images make some models hard; developer boards and older Huawei units have unlock/downgrade methods enabling TWRP, root, and custom ROMs.
note: many Redmi Note 7 variants use Snapdragon or MediaTek, check model.
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